Overview of vacuum hot pressing bonding machine uses

Main applications of the equipment:

1: Bonding of detection and analysis fluid chips used in the biological and pharmaceutical industries.

2: Bonding of modular medical monitoring chips

3: Bonding of human organ chips created based on microfluidics technology

4: Bonding of fluid chips with a small flow channel of 0.05mm

5: Bonding of various microfluidic mixing/droplet generation chips in the chemical industry

6: Bonding of various centrifugal chips and blood synthesis chips used in the pharmaceutical industry

7: Bonding of heterogeneous materials in the semiconductor industry.

Main parameters of vacuum hot pressing bonding machine

1: Maximum working temperature 350℃

2: Maximum working pressure 40KN (4T)

3: Maximum vacuum degree 200Pa (2mbar)

4: Work surface size: 500*500mm

5: Constant temperature stability of heating surface temperature (room temperature ~ 400℃): ±1 degrees Celsius

6: Machine weight: 450KG

7: Set pressure range: 0-40KN (4T)

8 : Pressure stability: (0-40KN range): ±20N

9: Pressure accuracy: (0-40KN range): ±4%

10: Vacuum accuracy: ±0.05pa

11: Heating table material: AL6061 surface hard anode

12: Heating control unit: Siemens PLC

13: Pressure control unit: Siemens PLC

14: Equipment display and operation interface: Siemens 12-inch LCD touch screen

15: Operating system: Siemens human-machine exchange interface

16: Operating parameter setting: 20-segment parameter intelligent continuous

17: One-key vacuum: Yes

18: Maximum heating rate: 6℃/minute

19: Fast heat dissipation method: Independent air cooling in the cavity

20: Pressure monitoring method: Real-time monitoring and real-time display

21: The screen displays the real-time temperature change curve: Yes

22: The screen displays the real-time pressure change curve: Yes

23: Pressure source: Siemens private service motor + reducer + Siemens driver

24: Vacuum pump standard: German Leybold vacuum pump

25: Vacuum gauge: German Leybold

26: Equipment rated voltage: 220V/50HZ

27: Equipment rated power: 4.2KW

28: Overall dimensions: 850 (length) * 680 (width) * 1800 (height) mm

29: Adjustable vacuum speed: Yes

30: Working parameters can be stored.

Advantages of vacuum hot pressing bonding

1: Suitable for bonding of various plastic materials (PMMA/PC/COC/PP/PEI, etc.)

2: No glue or other ingredients are required. Irreversible bonding force occurs when a certain pressure is applied at the glass transition temperature of the material surface.

3: The chip maintains the original physical and chemical properties of the material after bonding. It has good bonding advantages for some highly transparent plastic-based materials.

4: Good bonding force. Effectively avoids liquid seepage after gluing or laser bonding

5: Solved the problem that small-sized flow channels cannot be bonded

6: Chips with multi-layer substrates can be bonded at one time, which makes fluid chip design more convenient for integration

Operating environment

No special requirements

Minimum installation area 2 square meters, recommended 4 square meters

Ambient temperature: 10-40℃; relative humidity: 30-80%